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Products
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Memory
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Desktop Memory Modules
SDR Unbuffered DIMM - PC166/PC133
Capacity
SDR Unbuffered DIMM - PC166/133 168 Pins
Capacity
Chip Configuration
Chip Type
CAS Latency
SPD/ECC
64MB
4Mx16 (x8)
SDRAM
CL2, 3(PC133)
SPD
64MB
8Mx8 (x8)
SDRAM
CL2, 3(PC133)
SPD
64MB
8Mx8 (x9)
SDRAM
CL2, 3(PC133)
ECC & SPD
128MB
8Mx8 (x16)
SDRAM
CL2, 3 (PC166/PC133)
SPD
128MB
16Mx8 (x8)
SDRAM
CL2, 3 (PC166/PC133)
SPD
128MB
16Mx16 (x4)
SDRAM
CL2, 3 (PC166/PC133)
SPD
128MB
8Mx8 (x18)
SDRAM
CL2, 3 (PC166/PC133)
ECC & SPD
128MB
16Mx8 (x18)
SDRAM
CL2, 3 (PC166/PC133)
ECC & SPD
128MB
16Mx8 (x9)
SDRAM
CL2, 3 (PC166/PC133)
ECC & SPD
128MB
16Mx16 (x5)
SDRAM
CL2, 3 (PC166/PC133)
ECC & SPD
256MB
16Mx8 (x16)
SDRAM
CL2, 3 (PC166/PC133)
SPD
256MB
16Mx16 (x8)
SDRAM
CL2, 3 (PC166/PC133)
SPD
256MB
16Mx8 (x18)
SDRAM
CL2, 3 (PC166/PC133)
ECC & SPD
256MB
16Mx8 (x18)
SDRAM
CL2, 3 (PC166/PC133)
ECC & SPD
512MB
32Mx8 (x16)
SDRAM
CL2, 3 (PC166/PC133)
SPD
512MB
32Mx8 (x18)
SDRAM
CL2, 3 (PC166/PC133)
ECC & SPD
Features
168 edge connector pads
Clock Frequency:
166/133 MHz
LVTTL interface:
3.3 Voltage +/- 0.3V
Package:
TSOP
Specifications
JEDEC standard
Serial Presence Detect support
MRS cycle with address key programs
* CAS latency: 2, 3 (clock)
* Burst length: 1, 2, 4, 8 & full page
* Burst type: Sequential & Interleave
2 variations of refresh
* Auto refresh
* Self refresh
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